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XCZU7EV-2FBVB900I thermal resistance
Discover essential details about the XCZU7EV-2FBVB900I, including its thermal resistance, in the comprehensive Reference manual. Perfect for engineers looking to optimize their designs with this advanced component.
- Brands: AMD Xilinx
- Download: -
- Package: 900-BBGA, FCBGA
- Series: Zynq® UltraScale+™ MPSoC EV
- In Stock: 25,623
- Architecture: MCU, FPGA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Price: inquiry
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